3
Typically Miele
Application: electronics
• Unpopulated, populated or misprinted
circuit boards and ceramic substrates
• Soldering frames, soldering masks and
metal templates
Types of soiling
• Milling dust, solder paste, flux residues
and SMT adhesives
Cleaning requirements:
• Before populating
• After soldering
• After printing
• Before circuit tests
• Before lacquering
• After misprinting
Application: metal components
• Steel, stainless steel aluminium, copper,
brass, diecast zinc, hard alloys
Types of soiling
• Oil, emulsions, polishes, metal particles,
lapping abrasives
Cleaning requirements:
• Interim or final clean
• Before assembling or packing
• Before sticking, lacquering, welding,
soldering
• Before setting
• Before coating (e.g. TiN and TiC)
Application: glass and optical ware
• Coated and uncoated glass, e.g.
moulded glass, safety glass,
optical lenses
Types of soiling
• Dust, glass dust, fingerprints, particles,
lapping abrasives, polish, wax crayon
Cleaning requirements:
• Interim or final clean
• Before and after coating
Application: clean rooms
• Boxes, racks and chip trays
Types of soiling
• Dust, particles, photosensitive resist
Cleaning requirements:
• Particle decontamination
• Interim or final clean
• Before assembly or packing
• In clean rooms (e.g. Class 100)
Application: plastics
• Plastic components, magazines and
transport containers
Types of soiling
• Separating agent, dust, particles, oil
Cleaning requirements:
• Interim or final clean
• Before assembly or packing
