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and shall not be used in whole or in part without its written content
A
6 5 4 23 1
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
B
C
D
A
B
C
D
Following soldering conditions are recommended; Refer to Fig.1
E
F
G
H
6 5 4 3 2 1
E
F
G
H
300
300
0
0
50
100
time [s]
200150 250 350 400
max.60s
min.10s
Temperature [ ℃]
ramp up to
150℃
min.3k/s
50
150
100
min.110s
min.300s
min.190℃
200
250
T(solid)min.217 ℃
max.260℃
ramp down
from T(solid)
min.6k/s
max.255℃
Temperature profile for a lead-free reflow process
Soldering(Reflow)
(1)Soldering of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for "Reflow Soldering" under the
recommended solder profile .
(3)SMD Sound Transducers which during the reflow soldering process are exposed to too
high soldering temperatures and/or too large temperature gradient such as rapid heating or
cooling may lead to electrical failures and mechanical damages of the devices.
BCM4013OSBC-38
min.50s
Notice:
All specifications must be satisfied in this condition.
Sensitivity :Allowable deviation within ±3dB from initial sensitivity.
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Date
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Checked by:
Note
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Page:5 of 7
09.06.29
DRG NO:
BCM6022OSBC-38
Microphone
王焕焕
徐 波
A
王 平
BS/TEM01.130A
09.06.29
王焕焕
Acoustics & Sensor
