Dil ID: 12
Dil Adı: portugal
Dil Kodu: pt6tayfun Produtos da Marca Dell
Dünyanın En Büyük
Elektronik Bilgi Kütüphanesi



Leave the release lever extended in the release position so that the socket is ready for the new processor.
Replacing the Processor
1. Follow the instructions in Before You Begin.
2. Unpackthenewprocessor,beingcarefulnottotouchtheundersideoftheprocessor.
3. If the release lever on the socket is not fully extended, move it to that position.
4. Orient the front and rear alignment-notches on the processor with the front and rear alignment-tabs on the socket.
5. Align the pin-1 corners of the processor and socket.
6. Set the processor gently in the socket and ensure that the processor is positioned correctly.
7. When the processor is fully seated in the socket, close the processor cover.
Ensure that the tab on the processor cover is positioned underneath the center cover latch on the socket.
8. Pivot the socket release lever back towards the socket, and snap it into place to secure the processor.
9. Clean the thermal grease from the bottom of the heat sink.
10. Apply the new thermal grease to the top of the processor.
11. Replace the processor fan and heat sink assembly (see Replacing the Processor Fan and Heat Sink Assembly).
CAUTION: Ground yourself by touching an unpainted metal surface on the back of the computer.
CAUTION: When replacing the processor, do not touch any of the pins inside the socket or allow any objects to fall on the pins in the socket.
CAUTION: You must position the processor correctly in the socket to avoid permanent damage to the processor and the computer when you turn
on the computer.
CAUTION: To avoid damage, ensure that the processor aligns properly with the socket, and do not use excessive force when you install the
processor.
front alignment notch
processor pin-1 indicator
rear alignment notch
processor cover
tab
processor
socket
center cover latch
release lever
CAUTION: Ensure that you apply new thermal grease. New thermal grease is critical for ensuring adequate thermal bonding, which is a
requirement for optimal processor operation.